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CPU Module×SECO S.p.A - List of Manufacturers, Suppliers, Companies and Products

CPU Module Product List

1～15 item / All 67 items

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Qseven NXP i.MX8X CPU module

Qseven NXP i.MX8X CPU module

Qseven Rev. 2.1 compliant CPU module equipped with NXP i.MX 8X.

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, NXP, etc. ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

  • Embedded Board Computers

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Qseven NXP i.MX6 CPU module

Qseven NXP i.MX6 CPU module

Qseven compliant, CPU module equipped with NXP i.MX6

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available such as Intel, AMD, NXP ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

  • Embedded Board Computers

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μQseven NXP i.MX8M Mini CPU module

μQseven NXP i.MX8M Mini CPU module

μQseven compliant CPU module equipped with NXP i.MX 8M Mini or NXP i.MX 8M Nano.

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Many options available such as Intel, AMD, NXP ■Flexibility in functionality increase or decrease through BOM component changes ■Short development period, quick market launch

  • Embedded Board Computers

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Qseven NXP i.MX8M CPU module

Qseven NXP i.MX8M CPU module

Qseven Rev. 2.1 compliant CPU module with NXP i.MX8M.

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to achieve carrier board design compatible with both ARM and x86 ■Many options available, including Intel, AMD, NXP, etc. ■Flexibility in functionality increase or decrease due to BOM component changes ■Short development period, quick market launch

  • Embedded Board Computers

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Qseven Intel E3900 CPU module

Qseven Intel E3900 CPU module

Qseven Rev. 2.1 compliant CPU module with Intel Apollo Lake.

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Many options available, including Intel, AMD, NXP, etc. ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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COM-HPC Intel 11th Generation CPU Module

COM-HPC Intel 11th Generation CPU Module

COM-HPC compliant CPU module with Intel Tiger Lake UP3 (Client)

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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COM Express AMD V1000 CPU module

COM Express AMD V1000 CPU module

COM-EXPRESS TYPE6 compliant CPU module with AMD Ryzen V1000 (compact)

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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COM Express Intel D1700 CPU module

COM Express Intel D1700 CPU module

COM-EXPRESS TYPE7 compliant CPU module with Intel Xeon D1700 (Basic)

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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COM Express AMD R1000 CPU module

COM Express AMD R1000 CPU module

COM-EXPRESS TYPE6 compliant CPU module with AMD Ryzen R1000 (compact)

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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COM Express Intel E3900 CPU module

COM Express Intel E3900 CPU module

COM-EXPRESS TYPE6 compliant, Intel Apollo Lake equipped CPU module (compact)

■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successors ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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COM Express Intel 9th Generation CPU Module

COM Express Intel 9th Generation CPU Module

COM-EXPRESS TYPE6 compliant CPU module with Intel Coffee Lake (Basic)

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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COM Express AMD V2000 CPU module

COM Express AMD V2000 CPU module

COM-EXPRESS TYPE6 compliant, CPU module equipped with AMD Ryzen V2000 (compact)

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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COM-HPC Intel 12th Generation CPU Module

COM-HPC Intel 12th Generation CPU Module

COM-HPC compliant CPU module with Intel Alder Lake H (Client)

■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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SMARC Intel x6000E CPU module

SMARC Intel x6000E CPU module

SMARC Rev. 2.1.1 compliant, Intel Elkhart Lake【HALLEY】

■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible to design carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers

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SMARC Intel E3900 CPU module

SMARC Intel E3900 CPU module

SMARC Rev. 2.1.1 compliant, Intel Apollo Lake【JAGER】

■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in function increase or decrease due to BOM component changes ■Short development period, quick market launch

  • Embedded Board Computers

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